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FACTS & FIGURES
Established 1991
Headquarters Bassersdorf/Zurich, Switzerland
Manufacturing area 6000m2, including 600m2 of clean room (class: 10'000)
Employees 179
Engineering 30
Production 125
Products Flex, rigid-flex and rigid PCB’s
– High density/microvia
– Multilayer
– RF design (also using LCP)
– High temperature
– Microfluidic substrates
– Semiconductor substrates
Principal application sectors Medical, defense, aerospace, industrial, semiconductor
packaging
Main export markets USA, Europe, Asia, Australia
Management Michael Fink, Reinhard Düregger, Gloria Müller, Axel Weiss,
Roger Rüegg
ISO ISO 9001 since 1993
Standards & Compliance MIL-P-55110 Type 1-3, GF and GI, MIL-P-50884 Type 1-5,
Defence Standard 59-59, UL94 and UL796,
International Traffic in Arms Regulations (ITAR) Compliance
Membership

IPC, IMAPS, EIPC, ZVEI, EITI, FED, APTE, iNEMI

Collaboration with several European research institutes

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