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FACTS & FIGURES
Established 1991
Headquarters Bassersdorf/Zurich, Switzerland
Manufacturing area 6000m2, including 600m2 of clean room (class: 10'000)
Employees 165
Engineering 26
Production 123
Products Flex, rigid-flex and rigid PCB’s
– High density/microvia
– Multilayer
– RF design (also using LCP)
– High temperature
– Microfluidic substrates
– Semiconductor substrates
Principal application sectors Medical, defense, aerospace, industrial, semiconductor
packaging
Main export markets USA, Europe, Asia, Australia, Middle East, Africa
Management Michael Fink, Gloria Müller, Jürgen Steinbichler,
Simon Weisser, Roger Rüegg
ISO ISO 9001:2000 since 2002, ISO 9002 since 1993
Standards MIL-P-55110 Type 1-3, GF and GI, MIL-P-50884 Type 1-5,
Defence Standard 59-59, UL94 and UL796
Membership

IPC, IMAPS, EIPC, ZVEI, EITI, FED, APTE, iNEMI

Collaboration with several European research institutes

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