NEWS
2006
November
·
LCP multilayer substrate technology
·
DYCONEX at electronica 2006
May
·
DYCONEX at SMT HYBRID PACKAGING 2006
·
DYCONEX at 2006 IEEE MMT-S IMS
·
DYCOstrate® - Flexible PCB's for the design of
3D Substrates
·
Rigid Printed Circuit Boards are replacing
Ceramics
·
Flexible Printed Circuit Boards for Optoelectric
Transducers
January
·
DYCONEX appoint new Head Human Resources
»
2008
|
2007
| 2006 |
2005
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