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| NEWS |
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2009
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| December |
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DYCONEX develops new multilayer cavity LCP package substrate technology for High Frequency applications
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| November |
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DYCONEX introduces new measurement equipment |
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DYCONEX appoints new Quality Manager |
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DYCONEX appoints new Vice President Finance |
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| October |
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DYCONEX at RSNA in Chicago, USA |
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DYCONEX at COMPAMED in Duesseldorf, Germany |
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| September |
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DYCONEX at MILCOM 2009 in Boston, USA |
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| August |
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DYCONEX at the 2009 Medical Electronic Symposium in Tempe, AZ (USA) |
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DYCONEX at MEDTEC in Galway, Ireland |
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| July |
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DYCONEX appoint new Sales Representive for
USA-South |
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DYCONEX at the SMD Conference 2009 in Huntsville, AL
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| June |
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DYCONEX implements new mechanical drill equipment |
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| May |
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DYCONEX Implements Efficient Software for PCB Design Compensation
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DYCONEX at the Military & Aerospace Electronics Forum 2009 in San Diego, California |
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DYCONEX at the 2009 IEEE International Microwave Symposium in Boston, Massachusetts
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| April |
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DYCONEX installed new Plasma Desmearing Equipment |
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| March |
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DYCONEX announces new solutions with Photo-Imageable Coverlay (PIC)
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DYCONEX appoints new Vice President Operations
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| February |
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DYCONEX, Inc. obtain ITAR registration |
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DYCONEX at IMAPS Device Packaging in Arizona |
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DYCONEX sponsored a fund raising event of BAE Systems Insyte at the Hilled Charity Golf Day in June 2008 |
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| January |
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DYCONEX announces investment plans on schedule for its production manufacturing facility in 2009 |
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DYCONEX at the Southern Manufacturing & Electronics Exhibition in Farnborough (UK), Booth no. A24
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» 2010 | 2009 |2008 | 2007
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