| The DYCOstrate® Technology | ||
| Since 1991, DYCONEX has successfully implemented its DYCOstrate® technology in high-reliability flex, rigid-flex, or rigid microvia/HDI PCBs and MCM-Ls. Over this time DYCOstrate® has become DYCONEX main technology and since 2001 accounts for more than 90% of its total annual sales. In all these years DYCONEX has evolved the DYCOstrate® technology and its three main elements: |
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| - | the utilization of thin flexible materials | |
| today mainly polyimide, but also other materials, like LCP, are coming along | ||
| - | the ability to image ultra-fine structures | |
| traces below 25 micron have already been realized for advanced applications | ||
| - | a high-reliable microvia forming process | |
| today either realized by pure plasma etching or by combined laser/plasma processing | ||
These elements make DYCOstrate® a highly versatile technology, which enables a variety of build-up solutions for the challenging requirements of advanced electronics applications. Over the last years many DYCOstrate® build-up concepts have been adopted by the PCB industry and are offered today also by other microvia manufacturers. In the development process of the various microvia technologies, sequential build-up HDIs have been increasingly improved and replaced by DYCOstrate® build-ups, particularly for high-end rigid multilayer PCBs. |
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February 2004
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