Thanks to the development of new materials PCB’s are now capable of meeting the performance of ceramic materials at a significantly lower cost.

These materials withstand temperatures of up to 300°C and still show outstanding  mechanical stability. A special build developed by DYCONEX allows to match the mechanical snap-off behavior of ceramic materials, which in existing production lines has the benefit, that assembly fixtures and methods can be maintained.  As very high structure densities are feasible with these materials, DYCONEX offers 50 µm traces as well as 100 µm holes in 200 µm pads. In addition the use of thin di-electrica of for example 60 µm thickness makes it possible to build a 6 layer substrate no thicker than 0.5 mm.