DYCONEX manufactures high-density PCB’s, foldable in three dimensions.

For example a 10x5 mm² three layer build-up consisting of a 25 µm core and 12 µm outer layers with a bend-radius of a few hundred µm can be reduced severalfold in size. Combined with very dense wiring and a 200 µm bonding area it is then possible to apply chip on flex technology using Dyconex developed processes to enable solder mask openings as small as 80x100 µm with Ni/Au plating.