SMT HYBRID PACKAGING 2006, Europe's number one special interest event for System Integration in Micro Electronics, will be opening it's doors again on May 30, 2006.

Allow yourself to be inspired by our exhibition highlights in the fields of Optoelectronics, DYCOstrate® and Ceramic-Replacement. Come see for yourself. Visit us in Hall 9 booth no. 122.

More information about the SMT HYBRID PACKAGING can be found at http://www.mesago.de/de/SMT/main.htm

Our exhibition team is looking forward to welcoming you.