| DYCONEX AG INVESTING MORE THAN US$ 20 MILLION IN ADVANCED MANUFACTURING ENVIRONMENT AND TECHNOLOGY |
| DYCONEX AG, a leading manufacturer of high-end, high reliability printed circuit boards today announced that it will invest in excess of US$ 20 Million over the next 18 months at their Bassersdorf, Switzerland headquarter facility to extend its competitive advantages for the long-term. DYCONEX AG is a market leader in flexible printed circuit board applications for medical implantable devices and also serves a variety of military and industrial specialty applications. In 2005, DYCONEX AG began to implement a business model very similar to the ‹Foundry› concept well known in the Semiconductor Industry, which integrates leading technologies and operational excellence to achieve maximum predictability and cost efficiency. The released investment program consequently focuses on implementing advanced yield management techniques, process capabilities and efficiency increases, while at the same time broadening DYCONEX AG’s technology offering. ‹Absolute customer focus in combination with advanced technology, a robust process environment and world class design support, are our key differentiating attributes›, said Michael A. Fink, CEO of DYCONEX AG. ‹By applying the proven performance management methodologies from the chip industry to improve yield, cost and lead-time, we have been able to continuously and consistently improve the performance of our production over the past 24 months. In order to make the next big step, we are now migrating to a production environment very similar in culture and manufacturing approach to a semiconductor factory›, said J. Steinbichler, COO. Both, Michael A. Fink, CEO and Juergen Steinbichler, COO, have joined DYCONEX AG in the past 2 years, each having more than 20 years of experience in advanced Semiconductor technologies. |
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February 2007
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