| EMBEDDING RESISTORS ON CERAMIC SUBSTRATE IN FLEX PCBs |
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As an alternative to in-situ deposited thin film or thick film passive components, DYCONEX has developed integration technology based on embedding discrete ultra flat high precision resistors within flexible multilayer substrates. As a first example, resistors of 100 kΩ ± 0.1% were chosen to be integrated, and standard manufacturing processes were used to produce the samples. With the addition of just one additional process step, this versa-tile technique is compatible with sequential build-up technologies commonly used for HDI multilayer boards. Furthermore, the embedded resistors showed only minor changes during and following the integration procedure. The final flexible printed circuit boards were evaluated according to basic electrical, mechanical and thermal testing procedures (IPC/JEDEC) and displayed excellent robustness, e.g. passing the requirements for MSL 1 conditions. Future work will focus on the integration of other, similar discrete, passive components and on multi-component stacking technologies. |
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June 2007
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