After joining iNEMI in 2006, DYCONEX’s United States Regional Manager, Thomas Jacob, has assumed the chair of the «Substrates for Medical Devices Project», which is a sub-project of the iNEMI Medical Components Reliability Specifications Project.
Project Background
Substrates are one of the key interconnects in modern electronic medical devices and consist of system and subsystem boards, chip packages and flexible interconnects. This project covers rigid, flexible, and chip package substrates used in medical electronics, focussing on their density, quality and reliability performance. The substrate group provides baseline design, performance and quality standards relying on existing IPC, military, and JEDEC standards.
About iNEMI
The International Electronics Manufacturing Initiative's mission is to identify and close technology gaps, which includes the development and integration of the electronics industry supply infrastructure. Based in Herndon, Va., this industry-led consortium is made up of approximately 70 manufacturers, suppliers, industry associations and consortia, government agencies and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, establishes implementation projects to eliminate these gaps (both business and technical), and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. For additional information about iNEMI, visit www.iNEMI.org
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