| DYCONEX EXHIBITS AT DEVICE PACKAGING 2010 IN FOUNTAIN HILLS (USA), BOOTH # 39 | |||||||||
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Please visit us at the annual IMAPS Device Packaging 2010, which will take place at Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, Arizona USA. We will be showing our latest developments in technology and services at booth # 39.
More information about the show you will find at: http://www.imaps.org/devicepackaging/ Our exhibition team is looking forward to meeting with you. |
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February 2010
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