ABOUT_US TECHNOLOGY PRODUCTS NEWS_EVENTS CAREERS CONTACT

APPLICATIONSCAPABILITIESDESIGN SERVICESMATERIALSSURFACE PLATINGSDESIGN GUIDELINESDYCOSTRATEDYCOSTRATE-CMULTILAYERDENSTRATECONSTRATESTANDARD LEAD TIMESHOMESITEMAP
DENSTRATE
all dimensions in µm
max. substrate thickness
3500
min. conductor width/spacing non-plated layers* 
copper thickness 18 µm 
copper thickness 35 µm

80
110/120
min. conductor width/spacing plated layers*
175/175
min. final diameter of a PTH 
150
(min.aspect ratio 1:5)
min. buried via final diameter
150
(min.aspect ratio 1:5)
final blind via diameter 
450
(min aspect ratio 1:1)
min. outer layer pads
drill Ø + 500
min. inner layer pads
drill Ø + 600
*plated layers: layers where a PTH starts or ends, Cu-thickness 60 µm
(IPC standard)
*non-plated layer: internal layers where no Cu is added to plate the through
holes. Copper thickness 18 respectively 35 µm Cu.
This table does not describe all of our capabilities. If you need more detailed information please contact us to discuss your specific design.