| DYCOSTRATE-C® |
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all dimensions in µm
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| min. conductor width/spacing non-plated layers* |
45/55
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| min. conductor width/spacing plated layers* |
75/85
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| min. blind via diameter |
100
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| min. drilled via diameter |
250
(min. aspect ratio 1:5)
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| min. outer layer pads |
drill Ø + 350
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| min. inner layer pads |
drill Ø + 350
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| *plated layers: |
layers where a PTH starts or ends, Cu-thickness 60 µm |
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(IPC standard) |
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| *non-plated layer: |
internal layers where no Cu is added to plate the through |
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holes. Copper thickness 18 respectively 35 µm Cu. |
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This table does not describe all of our capabilities. If you need more detailed information please contact us to discuss your specific design.
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