INGREDIENTS – THE BASE MATERIALS DYCONEX is constantly investigating and validating the newest materials to improve the performance and properties of our printed circuits board and substrates.  Our customers benefit from superior material performance and product robustness and value DYCONEX engineering assistance during material introduction and qualification. Our key customers beat their competition by using the newest materials available.  Our base material portfolio features the following material classes: – Adhesiveless polyimide foils for ultra- flexible, thin substrates  – Advanced thermoplastics; e.g. LCP foils for substrate carriers and RF – Ultraplanar and high- temperature stable laminates for defense, MIL and packaging products – Carbon fibers, molybdenum, invar, titanium cores for heat dissipation and CTE constrained applications All our standard laminates and flexible foils, adhesives and solder masks are RoHS compliant since 2001. For some FR4 laminates a RoHS compliant version is available on request. For additional information please download information about DYCONEX materials: DYCONEX materials « back