DYCONEX microvia/HDI flex PCB

SURFACE PLATINGS

Process	ENIG	E-Ni/E-Au	Ni/reductive Au	OSP
Full name	Electroless nickel immersion gold	Electroplated nickel & gold	Electroless nickel immersion thick gold	Organic solderability preservative
Layer Thickness	Ni: 3 - 6 µm Au: 0.05 - 0.1 µm	Ni: 1.25 - 5 µm Au: 0.125 - 1.25 µm	Ni: 3 - 6 µm Au: 0.2 - 1.0 µm	0.2 - 0.5 µm
Multiple reflows	4	4	4	4+
Shelf life (mts)	6	12	6	12

Process	Imm. Ag	Imm. Sn	E-Ni/Pd/I-Au	HASL SnPb
Full name	Immersion silver	Immersion tin	Electroless nickel & palladium, immersion gold	Hot air solder levelling
Layer Thickness	0.2 - 0.5 µm	0.8 - 1.2 µm	Ni: 3 - 6 µm Pd: 0.25-0.75 µm Au: 0.075-0.2 µm	20 µm
Multiple reflows	5	5	5	5
Shelf life (mts)	12	12	12	12
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