HIGH PERFORMANCE INTERCONNECT SOLUTIONS DYCONEX is one of the printed circuit board pioneers and among the inventors of today's common microvia technology. We have developed several outstanding manufacturing and substrate technologies to help our customers solving extreme and complex problems with interconnect, thermal, RF, CTE, vibration and many other issues.  Most of our substrates look like standard laser enhanced microvia or mechanically drilled rigid, flexible or rigid-flexible and flex multilayer boards, but typically include a clever solution or invention inside that makes them more flexible to achieve a unique solution. For example, we are able to achieve a smaller bend radii than competitor. We have the ability to produce robust products to meet the highest reliability requirements and to allow operation in the harshest environments, such as applications in space or mounted into aircraft engines. We use special metals like Molybdenum, titanium and carbon fiber cores to stiffen and relax heat dissipation or CTE mismatch of the attached components. « back