PREMIUM TECHNOLOGY FOR OPTIMIZED PERFORMANCE The launch of the DYCOstrate® technology in 1992 became our biggest success story worldwide. Developed to meet the growing demand for applications with ultra high wiring density and complex packaging substrates, DYCOstrate® is our premium technology for optimized performance. This technology is based on plasma etching and laser drilling  as a drilling/milling tool for HDI micro vias, windows, contours  and other structures in thin flexible dielectrics. DYCOstrate® enables the production of rigid, rigid-flex, and flex substrates and is tailored to solve most requirements concerning thermal management, RF performance, stiffness, controlled thermal expansion, thickness and weight. DYCOstrate®-C is the rigid sequential build- up version (SBU) allowing up to 3 laser drilled microvia layers per side of a conventional multi-layer board. « back