| 1998 |
BGA interposer technology (DYCOre®) |
|
| 1997 |
Embedded microcoaxial structures |
|
| 1995 |
Epoxy-based, low-cost DYCOstrate®-C technology |
|
(Sequential Build-Up) |
|
| 1992 |
Microvia PCBs and MCMs foil technology |
|
(DYCOstrate®) |
|
| 1991 |
High-reliability rigid-flex multilayers (DYCOflex®) |
|
| 1988 |
CTE-constrained MLs with Copper-Carbon-Copper |
|
(CCC) |
|
| 1985 |
CTE-constrained MLs with Copper-Molybdenum- |
|
Copper (CMC) |
|
| 1984 |
SMD MLs with combination of blind and buried |
|
vias (DENSTRATE®) |
|
| 1983 |
CTE-constrained MLs with Copper-Invar-Copper |
|
(CIC) |
|
| 1980 |
Multilayers (MLs) for high-current loads |
|
|
|
2005 |
Embedded Passives |
|
| 2004 |
LCP Micro-Via Boards 2 and 4 Layers |
|
(Liquid Crystal Polymer) |
|
| 2003 |
Micro fluidic and Biosensor-Chips Technology |
|
| 2002 |
High-reliability microvia MLs produced by plasma- |
|
laser combination |
|
| 2001 |
Laser direct imaging of high-density patterns on flex |
|
substrates |
|
| 1999 |
Wrap-around microvia build-up for high-end |
|
applications |
|
| 1998 |
2x5-layer DYCOstrate® build-up for performance- |
|
driven applications |
|
| 1998 |
Introduction of plasma ablated grooves to enhance |
|
bendability of flex boards |
|
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