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OVERVIEWROADMAPADVANCED PCB TECHNOLOGYDYCOSTRATEMICROSYSTEMS HOMESITEMAP
TECHNOLOGY ROADMAP
Our technology roadmap estimates future demand for current and targeted customers and their requirements from the year 2009 to the year 2011.

The roadmap refers to regular production but many technologies are available at DYCONEX 1 year earlier for prototypes and R&D purposes.

Year
2009
2010
2011
Conductor line/space (µm)
40/45
35/40
30/35
Microvia pad diameter (µm)
50/140
40/120
40/100
Artwork tolerances (µm)
+/-8
+/-7
+/-7
Via/layer and layer/layer tolerances (µm)
+/-40
+/-35
+/-30

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