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OVERVIEWROADMAPADVANCED PCB TECHNOLOGYDYCOSTRATEMICROSYSTEMS HOMESITEMAP
TECHNOLOGY ROADMAP
Our technology roadmap estimates future demand for current and targeted customers and their requirements from the year 2008 to the year 2010.

The roadmap refers to regular production but many technologies are available at DYCONEX 1 year earlier for prototypes and R&D purposes.

Year
2008
2009
2010
Conductor line/space (µm)
30/30
25/25
15/15
Microvia pad diameter (µm)
150
100
80
Microvia diameter (µm)
50
25
25
Artwork tolerances (µm)
+/-5
+/-4
+/-2
via/layer and layer/layer tolerances (µm)
+/-15
+/-10
+/-7

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